Semiconductor Packaging Engineer

at  Collins Aerospace

Qualifications You Must Have:

• Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum 5 years’ of prior work experience or an Advanced Degree in a related field and minimum 3 years’ of prior work experience.
• Experience with MS Office programs (e.g., Word, Excel, PowerPoint).
• Experience working in a manufacturing and/or cleanroom environment.
• Experience working on manufacturing equipment.
• U.S. Person (U.S. citizen, permanent resident, refugee or asylee) are eligible to obtain necessary export authorizations required. https://www.ecfr.gov/current/title-22/chapter-I/subchapter-M/part-120/subpart-C/section-120.6

Qualifications We Prefer:

• Experience with wire bonding.
• Experience with hermetic sealing.
• Experience with automatic pick and place.
• Experience with flip chip assembly.
• Experience with solder reflow

Onsite
At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.
By joining our team in Princeton, NJ (Sensors Unlimited Inc.), you’ll have your own critical part to play in ensuring our customer succeeds today while anticipating their needs for tomorrow. Sensors Unlimited Inc. is the leading developer and manufacturer of shortwave infrared (SWIR) one- and two-dimension focal plane arrays, cameras, and systems. Our products have diverse applications in telecommunications, process/quality control, fiber optics inspection and military imaging industries www.sensorsinc.com.
We are looking for a talented Semiconductor Packaging Engineer to join our Process Engineering team to handle the daily operations of our semiconductor packaging cleanroom. You will be part of a multidisciplinary team of engineers developing state-of-the-art, next generation military and industrial imaging systems. Thinking outside the box, generating new ideas, and being an effective team player is essential for success in this role. The induvial will be responsible for the daily operations of a world class wafer processing and packaging plant.

What You Will Do:

• Determining root causes of failures using statistical methods and recommend changes in designs, tolerances, or processing methods.
• Utilize Lean Manufacturing techniques to reduce manufacturing costs and improve manufacturing yield.
• Maintaining semiconductor assembly equipment and current manufacturing processes.
• Investigate or resolve operational problems, such as material use variances or bottlenecks.
• Developing new advanced packaging methods for next generation products.
• Preparing and maintaining documentation for manufacturing processes and engineering procedures.
• Incorporating automation into manufacturing processes.
• Designing & manufacturing fixtures.
• Conducting time studies of manufacturing processes.
• Reviewing product designs for manufacturability or completeness.
• This 1st shift role will be 100% on-site and based in Princeton, NJ.

Qualifications You Must Have:

• Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum 5 years’ of prior work experience or an Advanced Degree in a related field and minimum 3 years’ of prior work experience.
• Experience with MS Office programs (e.g., Word, Excel, PowerPoint).
• Experience working in a manufacturing and/or cleanroom environment.
• Experience working on manufacturing equipment.
• U.S. Person (U.S. citizen, permanent resident, refugee or asylee) are eligible to obtain necessary export authorizations required. https://www.ecfr.gov/current/title-22/chapter-I/subchapter-M/part-120/subpart-C/section-120.62

Qualifications We Prefer:

• Experience with wire bonding.
• Experience with hermetic sealing.
• Experience with automatic pick and place.
• Experience with flip chip assembly.
• Experience with solder reflow.