SOC Thermal Engineer

at  Apple

San Diego, California, USA -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate16 Feb, 2025USD 296300 Annual18 Nov, 202410 year(s) or aboveDevice Design,Design,Modeling,Mobile Devices,Thermal Testing,Semiconductor,Pcb,Thermal Analysis,Assembly Processes,Data CollectionNoNo
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Description:

SUMMARY

Posted: Oct 16, 2024
Role Number:200573665
Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there’s no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development.

DESCRIPTION

This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance, Developing detailed and reduced-order thermal models, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.

  • BSEE + 10 years of industry experience.

PREFERRED QUALIFICATIONS

  • MSEE +10 years of industry experience.
  • Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices.
  • Knowledge of semiconductor, package, PCB or mobile device design and thermal testing.
  • Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies.
  • Knowledge of SoC design methodology, low-power techniques and thermal analysis methods.
  • Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages.
  • Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk etc.
  • Experience of data center cooling solution analysis, design and test.
  • Experience of experimental setup and data collection.

Responsibilities:

  • BSEE + 10 years of industry experience


REQUIREMENT SUMMARY

Min:10.0Max:15.0 year(s)

Information Technology/IT

IT Software - Other

Software Engineering

Graduate

Proficient

1

San Diego, CA, USA