Advanced Packaging Technology Process Integration Assistant Engineer
at Applied Materials
Singapore, Southeast, Singapore -
| Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
|---|---|---|---|---|---|---|---|
| Immediate | 07 Aug, 2024 | Not Specified | 08 May, 2024 | 2 year(s) or above | Semiconductor Process | No | No |
Required Visa Status:
| Citizen | GC |
| US Citizen | Student Visa |
| H1B | CPT |
| OPT | H4 Spouse of H1B |
| GC Green Card |
Employment Type:
| Full Time | Part Time |
| Permanent | Independent - 1099 |
| Contract – W2 | C2H Independent |
| C2H W2 | Contract – Corp 2 Corp |
| Contract to Hire – Corp 2 Corp |
Description:
Be part of an exciting team working on cutting-edge advanced packaging process technologies. Participate in process development and integration solution to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Partner and work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our customers, taking the solutions from concept to mass production. Responsibilities will include assisting in execution of process integration in clean room to make sure projects are completed successfully and delivered on time.
Responsibilities:
- Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
- Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows
- Owner for execution of module process, data collection for measurement & inspection to validate each process in integration
- Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner
- Occasional over-time to support process engineering activities
Requirements:
- ITE/ Diploma in Engineering or relevant studies
- Basic understanding on semiconductor process is preferred
- Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be added advantages
- Candidates with minimum experiences are welcome to apply
Qualifications
EDUCATION:
Technical Diploma
YEARS OF EXPERIENCE:
2 - 4 Years
WORK EXPERIENCE:
Additional Information
Responsibilities:
- Assisting engineer to work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
- Responsible for assisting in developing advanced 2.5D and 3D SiP MEOL and assembly flows
- Owner for execution of module process, data collection for measurement & inspection to validate each process in integration
- Interact with internal and external module process owners to align for tool time, execute process sequence and collect data to feedback to integration owner
- Occasional over-time to support process engineering activitie
REQUIREMENT SUMMARY
Min:2.0Max:4.0 year(s)
Information Technology/IT
IT Software - Other
Software Engineering
Diploma
Engineering
Proficient
1
Singapore, Singapore
