Chip Package Design Ingenieur /in (m/w/d)
at Mobileye
München, Bayern, Germany -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 13 Jun, 2024 | Not Specified | 13 Mar, 2024 | N/A | Good communication skills | No | No |
Required Visa Status:
Citizen | GC |
US Citizen | Student Visa |
H1B | CPT |
OPT | H4 Spouse of H1B |
GC Green Card |
Employment Type:
Full Time | Part Time |
Permanent | Independent - 1099 |
Contract – W2 | C2H Independent |
C2H W2 | Contract – Corp 2 Corp |
Contract to Hire – Corp 2 Corp |
Description:
Mobileye entwickelt leistungsstarke Langstrecken-LIDAR-Systeme der nächsten Generation für autonome Fahrzeuge. Das Projekt umfasst hochmoderne elektrooptische Module für FMCW-LIDAR, HW, VLSI, Mechanik, SW FW und Algorithmen. Wir suchen erfahrene Chip-Package-Designer:innen zur Verstärkung unseres LIDAR-HW-Teams.
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Responsibilities:
Please refer the Job description for details
REQUIREMENT SUMMARY
Min:N/AMax:5.0 year(s)
Information Technology/IT
Engineering Design / R&D
Information Technology
Graduate
Proficient
1
München, Germany