Design Engineer (m/f/d)
at Qorvo
München, Bayern, Germany -
| Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
|---|---|---|---|---|---|---|---|
| Immediate | 27 Sep, 2024 | Not Specified | 28 Jun, 2024 | N/A | Integration,Troubleshooting,Filters,Switches,Level Design,Characterization,Mobile Applications | No | No |
Required Visa Status:
| Citizen | GC |
| US Citizen | Student Visa |
| H1B | CPT |
| OPT | H4 Spouse of H1B |
| GC Green Card |
Employment Type:
| Full Time | Part Time |
| Permanent | Independent - 1099 |
| Contract – W2 | C2H Independent |
| C2H W2 | Contract – Corp 2 Corp |
| Contract to Hire – Corp 2 Corp |
Description:
DESIGN ENGINEER (M/F/D)
Experience Level: Individual Contributor
Job Type: Full-Time
Location:Germany - Munich, DE
Requisition ID: 7682
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.
Qorvo Munich GmbH, a subsidiary of QORVO Inc., is looking for a
QUALIFICATIONS:
- Responsible for module level design and integration of PAs, LNAs, switches, filters, and other components into highly compact multi-chip modules (MCM) for mobile applications
- Analyzing customer specifications and developing module architectures to meet customers’ requirements
- Implementation and continuous refinement of schematic/EM simulations of laminate-based modules using tools like ADS, HFSS, etc.
- Analysis and troubleshooting of sample performance and improvement of simulation accuracy
- Define and organize characterization, design verification, test, and production ramp support
- Regular documentation and presentation of results
Responsibilities:
- Responsible for module level design and integration of PAs, LNAs, switches, filters, and other components into highly compact multi-chip modules (MCM) for mobile applications
- Analyzing customer specifications and developing module architectures to meet customers’ requirements
- Implementation and continuous refinement of schematic/EM simulations of laminate-based modules using tools like ADS, HFSS, etc.
- Analysis and troubleshooting of sample performance and improvement of simulation accuracy
- Define and organize characterization, design verification, test, and production ramp support
- Regular documentation and presentation of results
REQUIREMENT SUMMARY
Min:N/AMax:5.0 year(s)
Information Technology/IT
Engineering Design / R&D
Information Technology
Graduate
Proficient
1
München, Germany
