DRAM Packaging Engineer

at  Apple

SUMMARY

Posted: Oct 3, 2023
Role Number:200480276
Envision what you could do here. At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there’s no telling what you could accomplish. As a member of our dynamic group, you will have the outstanding opportunity to craft upcoming products that will delight, and encourage millions of Apple’s customers every single day. SUMMARY: Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for finesse to work towards an extraordinary result? We are looking for a hardworking and hard-working DRAM Packaging Engineer to join our team. SEG Packaging is a key part of the HW Technologies team, this team invents, designs, develops and integrates electronic packaging solutions for the Apple’s internal and customized external components of hardware for its consumer electronic products. As a DRAM Packaging Engineer, you will be responsible for memory packaging development process. While working with the external memory vendors while steering their packaging design compatibility to Apple system components. You will partner with the internal SEG teams, defining the memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the system and product teams and overall program through the development and NPI cycle.

KEY QUALIFICATIONS

• 5+ years of experience working in package design and assembly process development for memory wirebond, stacked-die packages
• Proven understanding of assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling
• Knowledgeable in packaging materials, substrate technology, and their mechanical and thermal behaviors
• Shown working experience in package test and reliability, system-level downstream process interaction and packaging inspection metrology
• Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
• Strong written and verbal communication skills for working with internal multi-functional teams and OSATs

DESCRIPTION

• Define the memory package POR (plan of record): Package architecture, technology, process, form factor, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity. - Publish internal package specs for customized memory - Establish trusting and collaborative relationship and communication channels, as a direct collaborate with vendors for DRAM memory package development and qualification - Review, drive and approve the DRAM memory vendors DOEs/characterization plans, technology and product qualification and data for package development - Drive industry with sophisticated package processes, new materials and groundbreaking specifications - About 10% international travel required

EDUCATION & EXPERIENCE

• BS and 10+ years of relevant industry experience

Please refer the Job description for details