Entry Level Device Integration & Yield Engineer

at  NXP Semiconductors

NXP is looking for a Device, Integration, and Yield Engineer who is the primary liaison between Product Engineering/ Development and Manufacturing / Process Engineering. This role focuses on driving continuous yield improvement using our most advanced GaN technology. Responsibilities include both development and sustaining activities related to III-V semiconductor devices and products. This role must demonstrate strong sense of ownership and structured problem-solving capability, utilizing device physics, process flow knowledge, and statistical data analysis, to ensure high-yielding, high-quality products are delivered to the customer. Scripting and data automating skills are a plus to have.

QUALIFICATIONS:

• Minimum of a B.S. degree in Engineering degree.
• Must have strong work ethics, sense of urgency, drive results to meet committed timeline.
• Must take initiative, ownership and leadership to solve issues.
• Able to lead and work on cross-functional teams with diverse backgrounds.
• A team player that can multitask and thrive in a very dynamic and fast-paced environment.
• Good communication and interpersonal skills.
  More information about NXP in the United States…
  NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals

• Own product lines to make sure all parameters of our products are within spec limits and control limits. Quickly respond to outliers, find root causes and put fixes in place in the factory to make sure there’s no repeated failures.
• Identify potential yield-limiting issues through data analysis and yield hunting skills, initiate yield improving projects, organize and lead taskforces or working groups to drive projects to closure.
• Collaborate effectively with process engineering, manufacturing and business line R&D partners to identify technology gaps and deficiencies, evaluate and qualify mitigation and continuous improvement solutions.
• Have strong analytical skills to analyze Fab and sort test big data using JMP or any other data analysis skills. Data scripting and data automating skills are a plus.
• Lead taskforces or working groups using Structured Problem-Solving techniques with a sense of urgency.
• Have a good understanding of semiconductor device physics, process flow, reliability, electrical probing/test, etc.
• Have knowledge on RF/GaN (III-V) technologies are a plus.