Equipment Engineer (Wafer saw/Laser groove)

at  STATS ChipPAC Pte Ltd

KEY JOB ACCOUNTABILITIES:

• Responsible for maintenance and repair on any of the following equipment such as DISCO Wafer SAW (DFD 6360 and DFD6361) and DISCO laser groove.
• Manage a team of associate engineers.
• Provide technical support to manufacturing that includes machine conversion, device setup and line sustaining.
• Ensures 100% support to engineering group on device & recipe creation, equipment buy-off, evaluations, qualifications and support new product introduction NPI.
• Communicates with Manufacturing, Process, QA, Central Engineering (NPI) to solve issues involving other group.

REQUIRED EXPERIENCE AND QUALIFICATIONS:

• Possess wide application of most major concepts of specialization and ability to apply these concepts to a wide range of complex assignments.
• Requires through knowledge of practical applications of concepts, procedures and guidelines to solve extremely complex problems.
• Diploma / Degree in Electrical/ Electronics/ Mechanical / Mechatronics, or its equivalent Hands on experience in handling Wafer saw and Laser groove machine.

Please refer the Job description for details