Failure Analysis Engineer

at  IBM

Introduction
As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.
Your Role and Responsibilities
In this role you will have a background in physics, material science, or electrical engineering. You will have knowledge and experience with semiconductor unit process, integration, and electrical testing will be preferred. A Failure
Analysis Engineer requires a multi-discipline background.You need to independently perform focused ion beam (FIB), scanning electron microscope (SEM), transmission electron microscope (TEM) analysis on hardware created by state-of-the-art semiconductor technology, including EUV lithography, and work as a team to support multiple projects. You will be focused on FIB/SEM, you will use DB-FIB for fault isolation and TEM sample preparation.
You will work with fault isolation team to understand the circuit function and layout, then use the best suitable method to make a TEM sample, through in-situ, ex-situ, plan-view and inverted sample preparation approaches. You will work with the TEM Engineer for image/data analysis and get the failure mechanism.
The position is in IBM Research and you will report to IBM Semiconductors in Albany, NY. Due to the current equipment location, you will start working in IBM location at East Fishkill, NY, using the equipment there to perform failure analysis task while working with the Albany, NY team to move the equipment to Albany in 2~3 years.

Please refer the Job description for details