Group Leader - Transmission Electron Microscopy (TEM) Manager

at  Intel

JOB DESCRIPTION

Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world’s most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and 2 new greenfield sites in Ohio and Germany.
Intel recently created HVM Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development (TD) team and FSM fab managers.
This job requisition is seeking a Transmission Electron Microscopy (TEM) Group Leader in our FSM Ireland Analytical Laboratories. Selected candidate will manage a team of TEM staff operating 24/7 in a state-of-the-art TEM operation.

TEM Group Leader’s responsibilities include (but are not limited to):

• Nurture, grow and lead newly formed team, responsible for team health and people management, including technical coaching, skill development, training, and performance management.
• Ensure world class operational performance in safety, quality, and TEM area sample throughput.
• Understand area workflows and equipment, help manage tool fleet including optimizing area to increase output and reduce tool down time.
• Guide team to identify opportunities to improve workflows.
• Manage priorities across team in close sync with other lab managers and customers.
• Candidate should have the following behavioral skills:
• Demonstrated strength in leadership, teamwork, problem solving, and effective oral and written communication skills.
• Ability to work with multi-functional, multi-cultural teams.
• Strong in decision making and problem solving.
• A good motivator, with ability to listen.

QUALIFICATIONS

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Associate’s degree in science and engineering major.
• 4+ years’ experience in semiconductor fab analytical laboratory. Level of experience will be considered in determining applicants job grade.
• Ability to work on compressed work week and night shift.

Preferred Qualifications

• Bachelor’s degree or advanced degree in science and engineering major.
• 10+ years’ experience in a semiconductor fab TEM prep and imaging group.
• Experience with TEM prep and imaging automation.
• 2+ years’ of team leadership experience.
• Understanding of FinFET technology architecture, including Cu metallization.
• Experience in new semiconductor process technology development.
• Basic understanding on module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

• Nurture, grow and lead newly formed team, responsible for team health and people management, including technical coaching, skill development, training, and performance management.
• Ensure world class operational performance in safety, quality, and TEM area sample throughput.
• Understand area workflows and equipment, help manage tool fleet including optimizing area to increase output and reduce tool down time.
• Guide team to identify opportunities to improve workflows.
• Manage priorities across team in close sync with other lab managers and customers.
• Candidate should have the following behavioral skills:
• Demonstrated strength in leadership, teamwork, problem solving, and effective oral and written communication skills.
• Ability to work with multi-functional, multi-cultural teams.
• Strong in decision making and problem solving.
• A good motivator, with ability to listen