HBM Product Engineer

at  Micron

Boise, Idaho, USA -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate29 May, 2024Not Specified01 Mar, 2024N/AGood communication skillsNoNo
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Description:

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

OUR OPPORTUNITY SUMMARY:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.
As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Product Leads, Design, and Test Solutions Engineering to develop, deploy, optimize, and innovate test strategies for Micron’s HBM products. You will act as a key interface between a variety of engineering groups and specialties, demonstrating a diverse range of expertise to innovate new and improved test strategies, features, and technologies.
You will have or develop expert capability with Probe, Burn, and/or ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other engineers in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. The seniority level offered will be based on a combination of experience and education.
In HBM DEG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, “high bandwidth”; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.
Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.
(Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.

HOW TO QUALIFY:

  • ATE and at-speed interface and system testing experience
  • Familiarity with scan chain and loopback testing
  • Experience with Built-In Self-Test (BIST)-based testing
  • Understanding of semiconductor fabrication process, defectivity and marginality, and degradation mechanisms
  • BSEE or Higher
  • Productive and efficient time usage thereby leading to more effective work.
  • Satisfactory ability to convey or share ideas either verbally or in written form.

Responsibilities:

Please refer the Job description for details


REQUIREMENT SUMMARY

Min:N/AMax:5.0 year(s)

Information Technology/IT

IT Software - QA & Testing

Software Engineering

Graduate

Proficient

1

Boise, ID, USA