Memory Layout Design Graduate Trainee
at Intel
Penang, Pulau Pinang, Malaysia -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 10 Aug, 2024 | Not Specified | 11 May, 2024 | N/A | Interpersonal Skills,Perl,Computer Engineering,Tcl,Computer Science | No | No |
Required Visa Status:
Citizen | GC |
US Citizen | Student Visa |
H1B | CPT |
OPT | H4 Spouse of H1B |
GC Green Card |
Employment Type:
Full Time | Part Time |
Permanent | Independent - 1099 |
Contract – W2 | C2H Independent |
C2H W2 | Contract – Corp 2 Corp |
Contract to Hire – Corp 2 Corp |
Description:
JOB DESCRIPTION
As a Memory Design Graduate Trainee, you will be part of Intel Design Enablement (DE) focused on pathfinding and development of advanced memory technology and circuits to enable best-in-class memory collateral/IP and product design across all generations of Intel process technology.
As a member of this team, your responsibilities include (but not limited to):
- Memory pathfinding activities and power performance area (PPA) optimization through design technology co-optimization (DTCO)
- Product/design enablement
- Memory bitcell and complex periphery IC layout and automation
- Memory array/IP design, memory circuit innovation, testchip design/execution/validation
- Pre/post-Si validation/debug to enable yield and parametric tracking/ramp
QUALIFICATIONS
Minimum Qualifications:
- You should have Bachelor/Master/PhD in Electrical Engineering, Computer Engineering, Computer Science, or other related Electrical Scientific STEM field.
- Proficient in TCL, Perl or Python programming language.
- Unix/Linux operating system
Preferred Qualifications:
- Ability to work in a fast-paced, collaborative, and often intense project schedule.
- Excellent communication and interpersonal skills, a good team-player as well as able to work independently.
- Creative mind and self-motivated.
- Analytical problem solving and multitasking.
- Able to do pathfinding or research independently to find solutions.
designenablement
Responsibilities:
- Memory pathfinding activities and power performance area (PPA) optimization through design technology co-optimization (DTCO)
- Product/design enablement
- Memory bitcell and complex periphery IC layout and automation
- Memory array/IP design, memory circuit innovation, testchip design/execution/validation
- Pre/post-Si validation/debug to enable yield and parametric tracking/ram
REQUIREMENT SUMMARY
Min:N/AMax:5.0 year(s)
Electrical/Electronic Manufacturing
Engineering Design / R&D
Other
Graduate
Proficient
1
Penang, Malaysia