Module Development Engineer - Night Shift
at Intel
Hillsboro, Oregon, USA -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 03 Jun, 2024 | Not Specified | 04 Mar, 2024 | 1 year(s) or above | Technology,Process Control,Physics,Addition | No | No |
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Description:
JOB DESCRIPTION
Intel’s pursuit of Moore’s law drives constant state of the art innovations in Process and Packaging areas. Intel and the industry are entering the era of advanced packaging and Intel has brought in breakthrough advances in packaging through EMIB and Foveros technologies as announced in 2021. To further advance heterogenous integrated packaging capability over the next decade we are putting together a dedicated team, tooling and FAB to drive wafer level assembly technology development (WATD) in the Ronler campus in Oregon. Intel WATD at Intel Hillsboro is a technology development organization to develop future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.
Responsibilities included but not limited to the followings:
- Willing to work on a compressed work week (CWW)schedule. Shifts are twelve hours long from 7pm to 7am and rotate from three to four days a week-Shift 4: (nights frontend) PM-AM Sun-Tues and alternating Saturday nights and Shift 6: (nights back end) PM-AM. Wed-Fri, alternating Saturday nights
- Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
- Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
- Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
- Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
- Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
- Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
- Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
KNOWLEDGE AND/OR EXPERIENCE LISTED BELOW WOULD BE OBTAINED THROUGH A COMBINATION OF YOUR SCHOOLWORK AND/OR CLASSES AND/OR RESEARCH AND/OR RELEVANT PREVIOUS JOB AND/OR INTERNSHIP EXPERIENCES.
Minimum Qualifications:
- Must possess a Bachelor’s Degree with 1+ year of experience, OR Master’s Degree in electrical engineering or mechanical engineering or chemical engineering or physics or a similar Engineering discipline.
- Must be willing to work compressed work week night shift
Preferred Qualifications:
1+ years of experience with one or more of the following:
- Statistical Process Control (SPC)/Design of Experiments (DOE) principles.
- Fabrication floor presence and manufacturing interactions.
- Semiconductor fabrication processes and technology.
Responsibilities:
- Willing to work on a compressed work week (CWW)schedule. Shifts are twelve hours long from 7pm to 7am and rotate from three to four days a week-Shift 4: (nights frontend) PM-AM Sun-Tues and alternating Saturday nights and Shift 6: (nights back end) PM-AM. Wed-Fri, alternating Saturday nights
- Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
- Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
- Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
- Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
- Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
- Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
- Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap
REQUIREMENT SUMMARY
Min:1.0Max:6.0 year(s)
Mechanical or Industrial Engineering
Engineering Design / R&D
Mechanical Engineering
Graduate
Electrical engineering or mechanical engineering or chemical engineering or physics or a similar engineering discipline
Proficient
1
Hillsboro, OR, USA