MTS Packaging Engineer (External Manufacturing Operations, Backend Engineering)

at  Advanced Micro Devices Inc

PREFERRED EXPERIENCE:

• 8 years’ experience in Semiconductor packaging, focusing in the following areas - Post-Test processes - Lasermark, VM inspection, shipment package design with strong knowledge of quality system.
• Strong technical knowledge on device marking technology and automated vision inspection machine technology.
• Experience in NPI procedures and product shipment packaging design will be an advantage.
• Experience and knowledge dealing with visual mechanical criteria establishment / finetuning with different package types required
• Supplier management experience (OSAT) preferred.
• Experience with 8D problem solving techniques.
• Familiar with statistical control tools, DOE and JMP and basic Autocad.
• Bachelor/MS degree in Mechanical or Material or Manufacturing Engineering
• Creative, highly motivated self-driven individual with the demonstrated ability to independently complete complex engineering tasks
• Excellent cross functional project management, communication, and presentation skills.
• Good in writing and speaking in English & Mandarin.

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
Responsibilities:

THE ROLE:

We are looking for a candidate that can drive supplier engagement with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD’s environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology!

KEY RESPONSIBILITIES:

• Manage New Product Introduction activities and Product Ramp Up monitoring for post-test processes by working closely with AMD internal stakeholders.
• Co-work with AMD internal stakeholders and drive risk assessment, processing requirement definition and qualification for new products and/or processes at external manufacturing facilities for Mark / Inspection / Pack.
• Depth and breadth of considerations and validation to allow seamless execution of new product bringup and LVM production ramp.
• Proactively communicate task assignments/status to responsible parties and ensure schedule control with quality validation.
• Manage external manufacturing sites to ensure parts are manufactured to product specifications and achievement of product manufacturing KPI.
• Drive external manufacturing sites on issue resolution / opportunities for improvement supporting on process improvement and quality enhancement..
• Drive external manufacturing sites on technical cause and improvement for quality excursion resolution feedback from end customers.
• Timely execution of projects and special work requests, with comprehensive reports and analysis.
• Manage and execute Engineering change management / change controls and BOM changes.
• Site support / Audit as needed with travel.
• Will be involved in regional vendor management.
• Assist in additional duties as needed by supervisor.