NM DMO Thin Films CVD Development Engineer

at  Intel

JOB DESCRIPTION

Intel’s Disaggregation Manufacturing Organization (DMO) F11x Thin Films Chemical Vapor Deposition (CVD) Group is looking for an experienced Thin Films Technology Development Process Engineer in Rio Rancho, New Mexico.

As a Thin Films Technology Development Process Engineer you will be responsible for but are not limited to:

• Development and sustaining of Thin Films processes for next generation EMIB/Foveros/Foundry/SiP technology development and transfer to high volume manufacturing.
• Develop Thin Films processes that meet quality, reliability, cost, yield, productivity, and manufacturability requirements for HVM.
• Plan and conduct experiments to fully characterize Thin Films processes throughout the development cycle.
• Work closely with process integration, device, and the other unit process areas to define the process technology roadmap and turn that roadmap into reality.
• Engage closely with tool vendors for process development and sustaining issues. Drive escalations and ensure resolution to any process and/or equipment problems.
• Establish process control systems to meet key quality metrics.
• Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
• Define and maintain procedures for the module.
• Train production/receiving process engineers, and manufacturing technicians for transfer to other factories.

Full time onsite required during training, estimated 6 months. After training: hybrid “work from home” to be defined by manager and employee, but continued onsite will be required.

QUALIFICATIONS

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

MINIMUM QUALIFICATIONS:

The ideal candidate must have one the following Education requirements:

• PhD degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry or related fields with 2+ years of process engineering experience in the semiconductor industry.
• Master’s degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry or related fields with 4+ years of process engineering experience in the semiconductor industry.
• B.S. degree in Electrical Engineering, Chemical Engineering, Material Science, Physics, Chemistry or related fields with 6+ years of process engineering experience in the semiconductor industry.

PREFERRED QUALIFICATIONS:

• Ideal candidate will have 5+ years process engineering experience in Plasma Enhanced Chemical Vapor Deposition process development.
• Familiarity with multiple characterization techniques including, but not limited to XSEM, TEM, STEM, XPS, VPD, TXRF, as well as thin films metrology such as ellipsometry and stress characterization.

• Development and sustaining of Thin Films processes for next generation EMIB/Foveros/Foundry/SiP technology development and transfer to high volume manufacturing.
• Develop Thin Films processes that meet quality, reliability, cost, yield, productivity, and manufacturability requirements for HVM.
• Plan and conduct experiments to fully characterize Thin Films processes throughout the development cycle.
• Work closely with process integration, device, and the other unit process areas to define the process technology roadmap and turn that roadmap into reality.
• Engage closely with tool vendors for process development and sustaining issues. Drive escalations and ensure resolution to any process and/or equipment problems.
• Establish process control systems to meet key quality metrics.
• Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
• Define and maintain procedures for the module.
• Train production/receiving process engineers, and manufacturing technicians for transfer to other factories