NM IFS Integration Engineer
at Intel
Albuquerque, New Mexico, USA -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 05 Aug, 2024 | Not Specified | 06 May, 2024 | 1 year(s) or above | Perl,Process Control,Physics,Addition,Engineers,Process Integration,Leadership Skills,Chemistry,Programming Languages,Design,Tcl,Problem Solving,Machine Learning,Scripting Languages | No | No |
Required Visa Status:
Citizen | GC |
US Citizen | Student Visa |
H1B | CPT |
OPT | H4 Spouse of H1B |
GC Green Card |
Employment Type:
Full Time | Part Time |
Permanent | Independent - 1099 |
Contract – W2 | C2H Independent |
C2H W2 | Contract – Corp 2 Corp |
Contract to Hire – Corp 2 Corp |
Description:
JOB DESCRIPTION
Intel’s recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, with New Mexico Foundry Operations a key component of this effort.
This is an Individual Contributor role in Integration Engineering and will cover one of the following areas: Front-End/Transistors Segments, Back-End/Interconnects Segments, or Contacts Segments.
Responsibilities include the following but are not limited to:
- Process integration development.
- Technology transfer and startup.
- Task force leadership including Segment Team, Focus Team.
- Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data for new process qualifications and integrated issues.
- Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to improve process stability/capability.
- Developing solutions to problems utilizing formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools.
The ideal candidate will exhibit the following behavioral traits:
- Excellent communication skills and demonstrated ability to work across organizational boundaries to meet objectives and key results while fostering a challenging and positive work environment.
- Demonstrated track record of leading process integration and module engineering co-development.
- High tolerance of ambiguity demonstrated flexibility and adaptability in a fast-changing environment.
- Must be a self-starter, highly organized, and have the ability to work independently across organizations.
- Lead problem-solving efforts with creativity and out-of-box thinking as well as future, strategic, and possibility thinking.
Full time onsite required during training, estimated 6 months.
After training: hybrid “work from home” to be defined by manager and employee but continued onsite will be required.
QUALIFICATIONS
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
MINIMUM QUALIFICATIONS
- The candidate must possess a Bachelor’s, Master’s, or Ph.D. degree in Engineering, Physics, Electrical Engineering, Chemistry, Material Science, or a related field.
- BS 4+ years of experience, MS 3+ years of experience, or PhD 1+ years of experience on semiconductor materials, fabrication, electrical characterization, and device physics.
- BS 4+ years of experience, MS 3+ years of experience, or PhD 1+ years of experience on Statistical Process Control (SPC) or Design of Experiments (DOE) principles and engineering analysis tools.
- OR in lieu of degree, 7+ years of direct wafer fabrication and high volume factory experience in a process integration or yield role.
- Candidate must be willing to relocate to NM.
- This position is not eligible for Intel immigration sponsorship.
PREFERRED QUALIFICATIONS:
- Detailed understanding of Model Based Problem Solving (MBPS) as well as fab process control systems and methodologies.
- Working knowledge of device physics and process technologies.
- Semiconductor processing and device fabrication.
- Proven technical leadership skills with the ability to directly influence a diverse team of engineers.
- Process monitoring test structures design and layout experience.
- Expertise in database structures, research methods, machine learning, analytics packages (i.e., JMP, MATLAB, Octave), scripting languages (i.e., Python, JSL, Perl, TCL), or programming languages (i.e., SQL, C/C++).
Responsibilities:
- Process integration development.
- Technology transfer and startup.
- Task force leadership including Segment Team, Focus Team.
- Use Statistics, Data Mining, and other data analysis techniques to collect, explore, and extract insights from Electrical-test, yield, and fab data for new process qualifications and integrated issues.
- Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to improve process stability/capability.
- Developing solutions to problems utilizing formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools
REQUIREMENT SUMMARY
Min:1.0Max:7.0 year(s)
Electrical/Electronic Manufacturing
Engineering Design / R&D
Electrical
BSc
Electrical
Proficient
1
Albuquerque, NM, USA