NTI Senior Equipment Engineer/Equipment Engineer (Bonding/CMP)

at  Micron

Singapore, Southeast, Singapore -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate01 Sep, 2024Not Specified02 Jun, 2024N/AGood communication skillsNoNo
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Description:

OUR VISION IS TO TRANSFORM HOW THE WORLD USES INFORMATION TO ENRICH LIFE FOR ALL.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR55983 NTI Senior Equipment Engineer/Equipment Engineer (Bonding/CMP)
As a Senior Equipment Engineer/Equipment Engineer in the NTI, you will be expected to support R&D activities associated with rapid deployment of First-of-Kind equipment, the CIP hardware evaluations and managing on the timeline needed to deploy in current technode/next advance technode on time. Good team spirit and good collaborations working is needed with various stakeholders including (not limited to) facilities/fab support/Gas & Chemical/EHS/F4/F10/Central team etc with various equipment setup and improvement work necessitated thereof as well as to ensure extended engagement with F4 on the upcoming First-of-Kind equipment in upcoming technode. Expected to work independently with minimal direction and complete projects in a timely manner and achieve set objectives.

Responsibilities:

  • Install First-of-Kind equipment and/or CIP hardware for evaluation by the process development team to enable early introduction, maturity, and adoption for current and next node of 3D NAND technology.
  • Work with the Fab layout and facility team to ensure smooth and on time installation and operation of the equipment.
  • Work with process development team to quantify benefits of equipment/CIP hardware.
  • Develop and optimize existing equipment hardware to meet the productivity requirements of advanced 3D NAND parts.
  • Participate with Boise TD equipment development peers on technology choices for the upcoming nodes and able to translate future technology needs into clear equipment requirements.
  • Identify disruptive equipment early, work with manufacturing and Boise TD to identify viable evaluation path forward in manufacturing.
  • Design and implement advanced equipment monitoring and control methodologies.
  • Lead team or sites or suppliers on complex projects in focused meetings with end goal of maturity an equipment technology in record times for technical advantage, cost and productivity.
  • Serve as a technical expert within Micron, provide advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents/technical papers.
  • Identify and resolve safety hazards; follow safety procedures including lockout, chemical safety, lifting techniques and ergonomically correct methods.
  • Communications and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property protection policy is a must.
  • Self-motivated and adaptable to Micron’s fast paced, demanding and dynamic work environment; flexibility to work for extended hours, as required.
  • Excellent oral and written communication skills with ability to convey the message clearly and sharply both locally and globally.
  • Excellent ability to prioritize and manage multiple projects simultaneously; efficiently utilize available resources or seek peers’ and/or management help to get over the roadblocks to drive to solutions.
  • Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.


REQUIREMENT SUMMARY

Min:N/AMax:5.0 year(s)

Electrical/Electronic Manufacturing

Engineering Design / R&D

Other

Graduate

Proficient

1

Singapore, Singapore