PGDM Undergraduate Technical Intern
at Intel
Penang, Pulau Pinang, Malaysia -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 15 Sep, 2024 | Not Specified | 18 Jun, 2024 | 2 year(s) or above | It,Data Science,Computer Science | No | No |
Required Visa Status:
Citizen | GC |
US Citizen | Student Visa |
H1B | CPT |
OPT | H4 Spouse of H1B |
GC Green Card |
Employment Type:
Full Time | Part Time |
Permanent | Independent - 1099 |
Contract – W2 | C2H Independent |
C2H W2 | Contract – Corp 2 Corp |
Contract to Hire – Corp 2 Corp |
Description:
JOB DESCRIPTION
Intel’s recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel’s Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel’s supply chain for nearly five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel’s newest Advanced Packaging technologies and help us realize Intel’s vision to create and extend computing technology to connect and enrich the lives of every person on Earth. In this position you will be supporting organization operations to establish effective maintenance program toward best in class in safety, cost effective, interrupt free and conformant to ISO standard. Responsibilities will be included but not limited to: � 2-3 month internship supporting multiple manufacturing organizations. � Data analysis and report generation; ensuring systems operate reliably to avoid manufacturing/facility (or operations) impacts by meeting uptime goals. � Identify and implement opportunities to achieve lowest cost of ownership to key stakeholders while maintaining reliability.
QUALIFICATIONS
The candidate must be Malaysia Citizen and undergoing one of the following educational requirements: Degree in Chemical/Mechanical/Mechatronic/Materials/ Electrical Engineering, Computer Science, Data Science, IT or equivalent. CGPA Min 3.0. Minimum Qualifications: � � Preferred Qualifications: � � Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Responsibilities:
Please refer the Job description for details
REQUIREMENT SUMMARY
Min:2.0Max:3.0 year(s)
Mechanical or Industrial Engineering
Engineering Design / R&D
Mechanical Engineering
Graduate
Computer Science, Electrical, Electrical Engineering, Engineering, IT
Proficient
1
Penang, Malaysia