Principal ECAD Board Layout Engineer

at  Raytheon

Tucson, AZ 85756, USA -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate06 Sep, 2024USD 96000 Annual07 Jun, 20246 year(s) or aboveVideo Conferencing,History,Ipc,Communication Skills,Mathematics,Engineers,Altium,Technology,Ddr,Blueprint,Pcb,Creativity,Manufacturing Principles,Stem,Design Skills,Flex,Network Services,Schematic Capture,Design StandardsNoNo
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Description:

JOB SUMMARY:

The Product Design and Packaging (PDP) Team at Raytheon is seeking a Principal Electrical Engineer to join our team as an Electrical Computer Aided Designer Engineer (ECAD).
Our Mission is to develop best in industry technologies that align product capabilities to the needs of our customer. We will empower our people to leverage design commonality and innovation, balancing risk and rigor, to achieve predictable and affordable solutions. We are looking for candidates willing to collaborate, innovate, and team with our engineers to generate and utilize today’s cutting-edge technology.
This position is an onsite role, located in Tucson, AZ.

BASIC QUALIFICATIONS:

  • Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years of prior relevant experience, or an Advanced Degree in a related field and minimum 6 years of experience to include at least two (2) of the following:
  • Previous work history with PCB manufacturing or CCA manufacturing principles that affect circuitry and component layout along with RF specific layout techniques
  • Experience with the electrical design process including RF layout
  • History with laying out Rigid, Flex, or Rigid-Flex boards
  • The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

PREFERRED QUALIFICATIONS:

  • Working knowledge of Analog, Digital including DDR, RF, Power, and mixed technology, including multi-layer designs with High Density Interconnect (HDI) technology
  • Technical PCB design skills using the Siemens design toolset including, but not limited to the Xpedition Layout tool suite with working knowledge of schematic capture, placement, routing, use of the auto-router, constraint manager, and library tools, and use of BluePrint to create complex PCB and CCA drawings, Altium is not used, but transfers over well to the Siemens toolset
  • Export manufacturing data in both Gerber and ODB++ formats
  • Awareness of Valor NPI, Design for Manufacturing rule sets, other Design Rule Checking software
  • Understanding of drawings as they relate to PCB’s and CCA’s
  • Awareness of IPC 6012 & IPC 6013
  • Knowledge of military and commercial design standards, GD&T techniques, and overall producibility considerations related to electronic packaging
  • Strong written and verbal communication skills as well as strong customer interaction skills with engineers of all levels within own discipline
  • Must be able to communicate effectively through various means including Telecoms, MS Teams, Zoom, video conferencing, etc.
  • Ability to effectively multi-task and demonstrated capability to make improvements of processes, systems, or products to enhance performance of the work area
  • Must be able to own developing technical solutions to semi-complex problems through use of ingenuity and creativity with moderate supervision
  • Must be a self-starter and possess the ability to work autonomously while establishing schedule and priority needs
  • Must be proactive not only within their own discipline, but be able to apply those qualities to other similar/complementary disciplines with minimal supervision
  • Working knowledge of operating system concepts and implementations, network services as related to Microsoft Windows suites
  • Willingness to work extended hours (nights and/or weekends) as required to complete assigned tasking
  • Active Secret DoD security clearance

Responsibilities:

POSITION ROLE TYPE:

Onsite
At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

RESPONSIBILITIES TO ANTICIPATE:

  • Responsible for Printed Circuit Board (PCB) designs from conception to manufacturing
  • Creation of the PCB, Circuit Card Assembly (CCA), and Schematic drawings for suppliers
  • Schematic Capture, Component Placement, Routing of Traces, Gerber/ODB++ file creation
  • Utilizing software such as Siemens: Xpedition Enterprise and DownStream Technologies: BluePrint-PCB
  • Design layouts include Rigid, Flex, and Rigid-Flex assemblies
  • Work designs include full designs, re-spins, drawing updates, change notices, copper changes, and process improvement projects within and outside own discipline
  • Daily interface with various engineering levels along with different engineering disciplines including, but not limited to Electrical, Mechanical, Components, Test, and Producibility Engineering disciplines to ensure that the overall design requirements are captured, keeping cost, cycle time, and producibility in mind


REQUIREMENT SUMMARY

Min:6.0Max:8.0 year(s)

Electrical/Electronic Manufacturing

Engineering Design / R&D

Other

Graduate

Engineering, Mathematics, Technology

Proficient

1

Tucson, AZ 85756, USA