Principal Failure Analysis Engineer - ASIC/ MEMS
at AAC TECHNOLOGIES PTE LTD
Singapore, Southeast, Singapore -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 15 Aug, 2024 | USD 7000 Monthly | 16 May, 2024 | 10 year(s) or above | Fault Isolation,Physics,Cmos,Failure Analysis,Communication Skills,Mems,Commitments,Interpersonal Skills | No | No |
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Description:
Responsibilities
- Work with MEMS Research & Development, ASIC design team & Packaging team to perform failure analysis in root cause finding for improvement or issue investigation.
- In-charge of failure analysis request from internal customers and external customers for customer returns, production/process rejects, and reliability/engineering evaluation failures.
- Advise and provide technical inputs to cross-functional teams on appropriate FA techniques to employ in order to establish failure mechanism.
- Dive issue to closure when required.
- Develop new FA techniques with third party FA vendors to enhance detection capability or productivity.
- Drive improvement activities such as robustness and device functionality optimization as well as cost reduction activities.
- Other ad-hoc activities assigned by the reporting manager.
Requirements
- Bachelor’s Degree in Engineering (Material Science or Electrical/Electronic), Physics or equivalent. At least 10 years of experience in failure analysis of IC and/or MEMS at frontend and backend.
- Have excellent understanding and knowledge of physical and electrical FA techniques, including cross-section, TEM, EDX, SIMS, Obirch, EMMI, electrical fault isolation.
- Knowledge of semiconductor devices (CMOS, Bipolar, IGBT etc) are required Good understanding of semiconductor & MEMS device quality issues
- Strong leadership, communication skills & analytical mindset.
- Excellent interpersonal skills and team approach to problem-solving
- Self-driven, proactive and able to meet commitments
Responsibilities:
- Work with MEMS Research & Development, ASIC design team & Packaging team to perform failure analysis in root cause finding for improvement or issue investigation.
- In-charge of failure analysis request from internal customers and external customers for customer returns, production/process rejects, and reliability/engineering evaluation failures.
- Advise and provide technical inputs to cross-functional teams on appropriate FA techniques to employ in order to establish failure mechanism.
- Dive issue to closure when required.
- Develop new FA techniques with third party FA vendors to enhance detection capability or productivity.
- Drive improvement activities such as robustness and device functionality optimization as well as cost reduction activities.
- Other ad-hoc activities assigned by the reporting manager
REQUIREMENT SUMMARY
Min:10.0Max:15.0 year(s)
Electrical/Electronic Manufacturing
Engineering Design / R&D
Other
Graduate
Engineering (material science or electrical/electronic physics or equivalent
Proficient
1
Singapore, Singapore