Principal Material and Process Engineer – Advanced Microelectronics Packaging

at  Boeing

At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
We are Boeing Research and Technology (BR&T): Boeing’s global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists, and bold innovators. Join us and put your passion, determination, and skill to work building the future!
BR&T is looking to hire a Principal Material and Process Engineer – Advanced Microelectronics Packaging who will provide support to various space and defense programs, in El Segundo, California.
The Materials and Process Group in El Segundo develops, provides, and maintains technical competency and integrity in the definition, evaluation, analysis, management, selection and control of materials, processes, and parts. In this role, you will be responsible for the development, implementation, and continuous improvement of manufacturing equipment, tools, and processes.
The ideal candidate has a background with materials science and extensive experience with microelectronics process development and production engineering.

BASIC QUALIFICATIONS (REQUIRED SKILLS/EXPERIENCE):

• Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
• 10+ years of leadership within the microelectronic field
• 8+ years of experience with lab tools and general purpose lab equipment
• 8+ years of experience with implementing and monitoring statistical process controls

PREFERRED QUALIFICATIONS (DESIRED SKILLS/EXPERIENCE):

• 15+ years of experience of development, verification, and qualification of microelectronic heterogeneous integration capabilities
• Active Top Secret/Sensitive Compartment Information (TS/SCI) security clearance
• Experience within aerospace or related industry or with space electronics
• Experience with CAD, Finite Element Analysis (FEA), MES, Statistical Software (JMP, Minitab, etc.)
• Experience and skills to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources
• Experience leading teams on complex projects
• Experience reading and interpreting engineering documents, specifications, and drawings
• Experience with process development
• Experience with establishing production lines including facility planning
• Experience with equipment identification, validation, and implementation
• Experience working in a production environment
• Excellent oral and written technical communication skills and ability to communicate across multiple disciplines with internal and external customers
  Typical Education/Experience:
  Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 20 or more years’ related work experience or an equivalent combination of technical education and experience (e.g. PhD+15 years’ related work experience, Master+18 years’ related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard

• Assists with definition of requirements for tools, equipment, materials, parts and processes used in the engineering design, manufacture and/or maintenance of Boeing products
• Drafts engineering specifications and other documents to manage the deployment of tools, equipment, materials, parts and processes
• Assists with evaluation of emerging technologies for potential application to business needs
• Assists with development and qualification of new tools, equipment, materials, parts and processes to meet requirements
• Performs routine tests and audits to qualify suppliers to applicable requirements
• Conducts routine analysis to determine performance or reasons for failures of tools, materials, parts or processes
• Assists with implementing corrective and preventive actions
• Develops computer and production systems to satisfy user requirements
• Uses project management tools to meet cost, technical, and schedule requirements
• Incorporates environmental health and safety, LEAN and Quality principles into (1) materials and processes, (2) research, design and qualification, (3) work procedures and (4) labs and office areas
• Design and development of microelectronic packaging approaches for advanced electronics
• Leads development of manufacturing and assembly for advanced heterogeneous integration
• Establish and stand up new in-house production capabilities from process to equipment to facilities
• Supports external partners for development and production of custom designs
• Leads and mentors’ junior engineers and technical teams
• Stay updated with the latest industry trends and technologies in advanced packaging
• Documents and presents technical findings and developments to stakeholders and at industry conferences