Principal Process Development Engineer- Thin Films (PECVD / PVD)

at  SkyWater Technology Foundry Inc

Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters or Florida location, employees join together to improve the world.
Explore what’s possible. Joining our U.S. investor-owned team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!

POSITION SUMMARY:

We are looking for a hardworking and passionate Thin Films Process Development Engineer for our Florida Advanced Packaging site. In this role you will lead, develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.

REQUIRED QUALIFICATIONS:

Education: BS Engineering, MS/PhD preferred. Physics, Electrical Engineering, Materials Science or equivalent.

EXPERIENCE AND SKILLS:

• Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
• 5 years experience with BS, 2 years experience with MS or PhD
• MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
• Expert in process development for PECVD dielectrics (silicon oxides and nitrides).
• Expert in process development for metal thin films for damascene and TSV (through silicon via) seed layers and pad applications (Cu, Ti, Ta, Al, Au, TiW, etc.) using sputtering, reactive sputtering and e-beam evaporation.
• Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in (or lead) cross-functional teams for problem solving.

• Develop or integrate robust manufacturable process recipes for Foundry customers in PECVD and metal thin films deposition (sputtering and e-beam evaporation).
• Develop and control thin film processes optimized for product required film stress, thickness, optical properties.
• Work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
• Utilize metrology tools to characterize and document process results for transfer to production.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by integration changes.
• Act as a team leader or area owner for your unit process modules.
  The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.