Principal Process Integration Engineer - Advanced Packaging

at  Micron

Boise, Idaho, USA -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate03 Jun, 2024Not Specified03 Mar, 2024N/AGood communication skillsNoNo
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Description:

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Process Integration Engineer in Advanced Packaging Technology Development (APTD) within Micron, you will work on strategic packaging initiatives for high performance products critical to our future. You will collaborate with internal and external stakeholders to build and execute strategies aligned to organizational and business objectives by delivering high performing and cost-effective packaging solutions on time with highest quality and predictable reliability performance.

You will carry out Advanced Interconnects and package development and product transfers. You will set stretch goals and development objectives and measure your progress towards achieving these goals and objectives in collaboration with your leaders. You will monitor performance metrics to identify and implement continual improvement opportunities. Other opportunities include continued learning, mentoring other engineers, collaboration and engaging process and design engineers, and the development of sustainable solutions.

  • At least 5 years of Process Integration or Process Development experience in semiconductor industry. Knowledge of DRAM, NAND, 3D interconnects or packaging technologies, reliability, and failure modes (2.5D, 3DIC, FO, C2W, W2W etc.) a plus
  • Strong process/design architecture sense and ability to translate them to technical requirements and specifications
  • Ability to dive into details when needed to crystallize new concepts and/or resolve complex problems
  • Ability to analyze multiple and diverse sources of information to define problems accurately before moving to solutions
  • Think beyond conventions to deliver breakthroughs
  • Proven ability to lead small and large teams, directly or indirectly, toward common goals
  • Data extraction, analysis, and reporting skills (JMP, Python, R, etc.)
  • Solid understanding of probe, parametric, backend and reliability testing
  • In-depth understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
  • Strong understanding of electronic materials, processing, physical, chemical, and electrical properties, failure analysis, and characterization techniques
  • Proven ability to troubleshoot problems and address root causes
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities
  • Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics
  • Skill at effectively prioritizing multiple and complex tasks
  • Effective communication skill to align the perspective through cross functional teams
  • Tenacity to work effectively under tight timelines and limited resources
  • Ability to self-direct and measure with minimal supervision
  • Outstanding communication and presentation skills, written and verbal to all levels of an organization
  • Growth mindset and willingness to embrace and drive new initiatives and behaviors across organizations
  • Develop and Communicate Technology Development Requirements
  • Integrate Semiconductors while partnering with Process and Design teams
  • Design and tape out reticles, Develop process flows and secure resources including wafers and processes
  • Run process experiments and analyze data, provide actionable outcomes and decisions for process changes or integration flow changes.
  • Achieve and impove yields, work with Probe, Yield Analysis, Test, Reliability Engineering and drive improvements.

Required Education: PhD or MS plus relevant experience
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Responsibilities:

Please refer the Job description for details


REQUIREMENT SUMMARY

Min:N/AMax:5.0 year(s)

Information Technology/IT

IT Software - Other

Software Engineering

Graduate

Proficient

1

Boise, ID, USA