Principal Semiconductor Backside Lead Engineer

at  Raytheon

Qualifications You Must Have:

• Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum 8 years’ of prior work experience or an Advanced Degree in a related field and minimum 5 years’ of prior work experience.
• Experience with semiconductor backside processing (e.g., wafer bond and de-bond, wafer thinning, and singulation).
• Experience developing and/or sustaining semiconductor toolsets and processes.
• The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Qualifications We Prefer:

• Experience with III-V compound semiconductor processing and devices (e.g., Gallium Nitride and Gallium Arsenide).
• Experience in design of experiments and use of statistical data analysis and statistical process control (SPC).
• Experience leading and coordinating project work in a team environment.
• Experience creating, documenting, maintaining and approving work instructions.
• Experience training and certifying users on semiconductor processes and equipment

Onsite
At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.
An opportunity exists in the Advanced Microelectronics Solutions (AMS) Department, a part of Raytheon, for a Principal Semiconductor Backside Lead Engineer in the area of Backside Processing. AMS develops, designs, and manufactures compound semiconductor devices, millimeter/microwave integrated circuits, focal plane arrays, and modules for defense and commercial applications.

What You Will Do:

• Serve as a technical lead for a small team to achieve foundry metrics in the Backside Processing Work Center.
• Support the foundry’s production efforts through lot deposition, process sustainment, RCCA, and process improvement activities.
• Develop, improve, and sustain backside wafer processes including wafer bond and de-bond, wafer thinning, and singulation.
• Lead capital procurement and qualification efforts as they arise.
• This role will be 100% on-site and based in Andover, MA.
• This position is for 1st Shift.

Qualifications You Must Have:

• Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum 8 years’ of prior work experience or an Advanced Degree in a related field and minimum 5 years’ of prior work experience.
• Experience with semiconductor backside processing (e.g., wafer bond and de-bond, wafer thinning, and singulation).
• Experience developing and/or sustaining semiconductor toolsets and processes.
• The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Qualifications We Prefer:

• Experience with III-V compound semiconductor processing and devices (e.g., Gallium Nitride and Gallium Arsenide).
• Experience in design of experiments and use of statistical data analysis and statistical process control (SPC).
• Experience leading and coordinating project work in a team environment.
• Experience creating, documenting, maintaining and approving work instructions.
• Experience training and certifying users on semiconductor processes and equipment.