Produktionstechniker (mwd) / Technician I-Production

at  Microchip Technology

Teltow, Brandenburg, Germany -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate22 Jul, 2024Not Specified28 Apr, 2024N/AGood communication skillsNoNo
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Description:

Are you looking for a unique opportunity to be a part of something great? Want to join a 20,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology, Inc.
People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our
Vision, Mission, and 11 Guiding Values
; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over
30 years of quarterly profitability
without a great team dedicated to empowering innovation. People like you.
Visit our
careers
page to see what exciting opportunities and company
perks
await!
Job Description:
Sie sind dem Produktionsleiter unterstellt und gehören zum Produktionsteam, das für die Einrichtung von Maschinen in unserer SAW-Produktionslinie (Surface Acoustic Wave) zuständig ist.
Was ist das Attraktive an dieser Gelegenheit?
In dieser Position werden Sie mit einer Vielzahl von Herausforderungen konfrontiert, die mit den Backend-Fertigungstechnologien für Surface Acoustic Wave Filter und Oszillatoren zusammenhängen.

Weitere Einzelheiten zu den Erwartungen und Verantwortlichkeiten in dieser Position:

  • Drahtbonden
  • Die-Kontaktierung
  • Feinabstimmung
  • Deckel-Bestückung
  • Flip-Chip-Bonden
  • Arbeit mit Arbeitsanweisungen und Inspektionsanforderungen in Übereinstimmung mit dokumentierten Prozessen

Reporting to the Production Manager, you will be part of the production team responsible for setting up machines in our SAW production (Surface Acoustic Wave) line.
What’s attractive about this opportunity?
This position will expose you to a wide variety challenges related to backend
manufacturing technologies for Surface Acoustic Wave filters and oscillators.

More details on the expectations and responsibilities in this position:

  • Wire-bonding
  • Die-bonding
  • Finetuning
  • Lid-Placement
  • Flip chip bonding
  • Work with work instructions and inspection requirements in accordance with documented processes

Requirements/Qualifications:

Qualifikationen/Anforderungen:

  • Abgeschlossene technische Ausbildung, (Techniker oder höhere Qualifikation)
  • Verständnis für technische Zusammenhänge
  • Feinmotorische Handarbeit unter dem Mikroskop
  • Microsoft Office-Kenntnisse

Kompetenzen:

  • Gutes technisches und elektronisches Verständnis für die Unterstützung der Produktionsanlagen
  • Abteilungsübergreifende Teamarbeit
  • Hohe Zuverlässigkeit
  • Gute deutsche Sprachkenntnisse sind erforderlich

  • Completed technical training, technician or higher qualification
  • Understanding for technical relationships
  • Fine motoric hand work under microscope
  • Microsoft office knowledges

    Competencies

  • Good technical and electronical understanding to support the manufacturing equipment.

  • Interdepartmental teamwork
  • High reliability
  • Good German language skills are required

Travel Time:
No Trave

Responsibilities:

  • Wire-bonding
  • Die-bonding
  • Finetuning
  • Lid-Placement
  • Flip chip bonding
  • Work with work instructions and inspection requirements in accordance with documented processe


REQUIREMENT SUMMARY

Min:N/AMax:5.0 year(s)

Information Technology/IT

Engineering Design / R&D

Technician

Graduate

Proficient

1

Teltow, Germany