Senior Associate Engineer

at  STATS ChipPAC Pte Ltd

Singapore, Southeast, Singapore -

Start DateExpiry DateSalaryPosted OnExperienceSkillsTelecommuteSponsor Visa
Immediate28 Sep, 2024USD 5000 Monthly29 Jun, 20242 year(s) or abovePhysics,TrainingNoNo
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Description:

KEY JOB ACCOUNTABILITIES (ACTUAL DAILY DELIVERABLES):

  • Perform set-up and conversion to support production
  • Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts
  • Determine methods and procedures independently and provide guidance to less experienced team members when required
  • Communicate with Engineers and external vendors to resolve problems and provide advanced training to less experienced Technical Specialists
  • Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost

REQUIRED QUALIFICATIONS:

  • Diploma in Mechanical Engineering, Physics, Chemical, Material Sciences or equivalent
  • 2 years of relevant experience in wafer bumping or wafer fabrication are preferred otherwise candidates without experience are welcomed to apply as training will be provided
  • Ability to work on 12 hours rotating shift
    *We regret to inform that only short-listed candidates will be notified

Responsibilities:

Please refer the Job description for details


REQUIREMENT SUMMARY

Min:2.0Max:7.0 year(s)

Mechanical or Industrial Engineering

Engineering Design / R&D

Mechanical Engineering

Diploma

Mechanical Engineering, Chemical, Engineering

Proficient

1

Singapore, Singapore