Senior Digital IC Engineer

at  Oticon

• Join Our Innovative Chipset Team!
  Are you a passionate digital IC designer with a talent for IC architecture and digital implementation? Would you like to contribute to the development of advanced solutions that positively impact millions of people worldwide? If so, we invite you to apply for this exciting opportunity by sending us your CV.
  Welcome to Chipset, a key division of our Research and Development department. We specialize in the creation of chipsets for our renowned hearing instruments and accessories. Our continuous pursuit of technological quality enables us to deliver professional-grade solutions in DSP processing, audio quality, connectivity, AI integration, and re-chargeability - all in compact form factors with minimal power consumption.

ABOUT YOU

We are seeking a digital IC engineer with a comprehensive understanding of physical implementation. The ideal candidate will have experience with clocking/reset considerations, power islands and UPF, memory structures for low-power devices, MBIST, scan, and other test structures.
In this role, you will work closely with our physical implementation team at Demant, and should have a good understanding of how physical design aspects affect the implementation process and tooling. You will also collaborate with digital IC engineers developing RTL for new chipset features.
If you are excited about shaping the future of digital IC engineering, we encourage you to apply and join us in our mission to enhance the lives of millions through new technology.

The ideal candidate will have some of the following education and experience:

• Extensive RTL experience in developing highly digital ICs
• Experience in developing low-power SOCs
• Comprehensive architecture experience with digital ICs
• Experience with physical synthesis
• Some experience working closely with physical IC teams

A relevant degree in electronics or computer engineering (BS, MS, or Ph.D.) is also required.

As a Senior Digital IC Engineer, you will join our close-knit and inclusive Chipset team, comprised of over 60 experienced professionals. In this important role, you will contribute to the setting the direction and development of digital microelectronics integrated within our hearing aid chipsets, including those used by leading brands such as Oticon, Philips, and Bernafon.
Our Chipset group is forming a new team responsible for the architecture and implementation of our chipsets. This team will ensure that we have an optimal architecture that can be effectively implemented during the physical design process. In this role, you will be responsible for architecting implementation-specific aspects of our chipsets, such as the clock/reset scheme, voltage regions and control, memory subsystem, and chip test infrastructure. These key architecture choices drive the efficiency, performance, and reliability of our systems, and you will work in close collaboration with in-house physical IC designers.
Our advanced System-on-Chip (SoC) chipset includes subsystems such as custom audio processor cores, ARM processor cores, deep neural network (DNN) implementation, packet-based interconnect NoC (network on a chip), audio signal processing, analog to digital conversion, wireless connectivity, and power management.
Within our innovative department, you will find a thriving community of skilled engineers specializing in various facets of chipset development, including firmware, physical IC design, chipset test and support, analog IC design, and digital IC design. We employ top-of-the-line tools, methodologies, and technologies, offering end-to-end chipset development capabilities.