Senior Flip Chip Interconnect Assembly & Packaging Engineer

at  LUMILEDS SINGAPORE PTE LTD

WHO WE ARE:

Lumileds is the leading global light engine company serving customers in automotive lighting, general illumination, and consumer market segments. Lumileds operates in over 30 countries and has approximately 6,000 employees , Lumileds is shaping the future of light with the most innovative technology in the illumination and automotive sectors, and helping our customers deliver differentiated solutions to the world. Lumileds is headquartered in San Jose, California, with operations in Singapore, Malaysia, Poland, Germany and the Netherlands and sales offices throughout the world.

TOGETHER WITH ITS CUSTOMERS, LUMILEDS IS MAKING THE WORLD BETTER, SAFER, MORE BEAUTIFUL—WITH LIGHT.

The Lumileds environment is fast-paced, cutting-edge, intelligent and fun! We are looking for exceptional talent to join our team! To learn more, visit Lumileds.com

WHAT YOU WILL BRING (REQUIRED QUALIFICATIONS):

• PhD/Master/BSc/BEng in Material Science, Chemical, Polymer Science, Chemistry, Physics, Electrical or Mechanical Engineering with at least 5 years of experience with direct technical background in semiconductor interconnect assembly & packaging.
• Prior work experience in new product and/or new process development and qualification; experience in microLED processing, Interconnect assembly with experience in Flip chip, thermocompression bonding, and underfill will be an advantage.
• Knowledge in advanced semiconductor wafer level packaging assembly, wire-bonding, molding, wafer level fan out and fan in, will be advantage.
• Knowledge in temporary bonding and laser debonding, dicing, wafer reconstitution , will be an advantage.
• Self driven, strong team player and able to work independently, excellent communication and problem-solving skills.
• Passionate about work and have positive mindset.

• Partner with the business unit and design team to develop interconnect and assembly packaging technologies solutions from design, prototyping and product qualification to meet technology and product roadmap.
• Cross-functional teams collaboration, engagement with research institutions, tool and material suppliers in supporting product qualification, innovate interconnect / packaging materials solution to enhance product reliability and performance.
• Establish robust process margins, inline SPC controls with good Cp/Cpk performance.
• Provide documentation (characterization reports, operating instructions, control plan, etc) & regular technical reporting and coordinate internally and externally to fulfil the Technology and Product Development programs.
• Perform analysis on process performance, yield, establish design rules, manufacturing cost and cycle-time.
• Contribute in planning and execution of essential continuous improvement program and where required ensure implementation of effective corrective and preventive actions.
• Serve as a technical team member and a subject matter expert.