Senior Manager Chip-Package-Board CoDesign and Verification (f/m/div)*
at Infineon Technologies
München, Bayern, Germany -
Start Date | Expiry Date | Salary | Posted On | Experience | Skills | Telecommute | Sponsor Visa |
---|---|---|---|---|---|---|---|
Immediate | 21 Jun, 2024 | Not Specified | 21 Mar, 2024 | N/A | Good communication skills | No | No |
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Description:
We are looking for an experienced and skilled individual to take over the role of a team lead of an interdisciplinary and international team.
In your new role, you will:
- Lead a team of development engineers dedicated to package/board design and verification services (electrical/thermal) for internal customers.
- Be responsible for personnel development and resource planning.
- Engage with stakeholders to manage expectations and translate product requirements into effective design and verification services .
- Understand next generation project demands and identify areas for design flow enhancements.
- Further improve the work processes within the team.
- Analyze and resolve challenges of high complexity utilizing your global expert network.
- Foster a positive team spirit that encourages collaboration and accountability.
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You remain aware of the big picture even in complex situations and take decisions despite uncertain circumstances. You have the passion and the courage to develop new and creative ideas and beside you are inspiring others for your ideas and explain even complex issues in a clear and convincing manner. On top, you respect different attitudes and points of view and use the creative potential they offer.
You are best equipped for this task if you have:
- Degree in Electrical Engineering, Electronics, Physics or similar
- 6+ years of professional experience , with minimum 3 years experiences in leading a team.
- Knowledge in IC packaging and/or PCB technologies as well as the related design and verification EDA tools and flows.
- Strong communication and stakeholder management skills to resolve conflicts and the ability to manage budgets and resources effectively.
- A customer-oriented mindset with the ambition to solve technical and non-technical challenges.
- Fluent English skills , German skills are a big plus.
In our headquarters in Neubiberg near Munich, more than 6000 employees are working in research & development, several central functions, IT and many more.
Responsibilities:
- Lead a team of development engineers dedicated to package/board design and verification services (electrical/thermal) for internal customers.
- Be responsible for personnel development and resource planning.
- Engage with stakeholders to manage expectations and translate product requirements into effective design and verification services .
- Understand next generation project demands and identify areas for design flow enhancements.
- Further improve the work processes within the team.
- Analyze and resolve challenges of high complexity utilizing your global expert network.
- Foster a positive team spirit that encourages collaboration and accountability
REQUIREMENT SUMMARY
Min:N/AMax:5.0 year(s)
Electrical/Electronic Manufacturing
Engineering Design / R&D
Other
Graduate
Electrical, Electrical Engineering, Engineering
Proficient
1
München, Germany