Senior Staff Engineer Thinning Process

at  Infineon Technologies

I

n your new role you will:•

• erform process engineering and production support in one selected assigned area of semiconductor process.•
• ork as a team between Manufacturing / Maintenances / UPE / LBS / Technology / Quality to resolve production and quality issues and reduce production line disruptions.•
• upport tools installations as well as process & technology transfers to meet company targets, following standard process & tool release business flow•
• erform FMEA, risk assessment of process changes, with proper process change management•
• nsure the robustness of processes with Advance Process Control (APC), Statistical Process Control (SPC) and other process control tools.•
• anage recipe and procedural control. Develop and maintain process operation specifications as well as Out of Control Action Plan (OCAP)•
• nitiate, coordinate and support excursion prevention, cost reduction and quality improvement projects.•
• repare Standard Operation Procedure (SOP), Out of Control Plan (OCAP) and others technical documentation for production.•
• ctively involves in cost saving, production cycle time improvement and continuous scraps improvement program in wafers thinning.

Y

ou are best equipped for this task if you have:•

• achelor / Master / PhD degree in Engineering in Mechanical / Electrical / Mechatronics / Microelectronics / Physics disciplines or relevant qualifications are required.•
• t least 5 years working and hands-on experience in wafer fab thinning / back grinding / mounting / defect density processes, and related equipment engineering.•
• xperience and have good methodical technique in technology synchronization and process harmonization.•
• ood knowledge in semiconductor unit processes, process integration, device physics and products will be of added advantage.•
• ood hands-on experience on wafer fabrication processes, equipment and metrology.•
• echnology and or product transfer, qualification and high volume ramp-up know-how.•
• ighly innovative, motivated and stress resistant individual with zero defect mindset•
• good team player and able to communicate effectively in cross functional teams and at all levels.

I
n our wafer production in Kulim we are producing more than 100.000 wafer each month.
D

• erform process engineering and production support in one selected assigned area of semiconductor process.•
• ork as a team between Manufacturing / Maintenances / UPE / LBS / Technology / Quality to resolve production and quality issues and reduce production line disruptions.•
• upport tools installations as well as process & technology transfers to meet company targets, following standard process & tool release business flow•
• erform FMEA, risk assessment of process changes, with proper process change management•
• nsure the robustness of processes with Advance Process Control (APC), Statistical Process Control (SPC) and other process control tools.•
• anage recipe and procedural control. Develop and maintain process operation specifications as well as Out of Control Action Plan (OCAP)•
• nitiate, coordinate and support excursion prevention, cost reduction and quality improvement projects.•
• repare Standard Operation Procedure (SOP), Out of Control Plan (OCAP) and others technical documentation for production.•
• ctively involves in cost saving, production cycle time improvement and continuous scraps improvement program in wafers thinning