Snr / Technical Program Manager

at  Blessed Agape Connections

REQUIREMENTS

• Engineering Degree with 10+ years minimum work experience or equivalent in IC assembly related companies or semiconductor environment.
• Must have experience working with advanced packages
• Good knowledge of FOL (front-of-line) and EOL (end-of-line) assembly operations
• Well versed in SPC and DOE
• Must have strong verbal, written, interpersonal communication and presentation skills. Must enjoy working with others, highly organized, ability to take initiative/task orientated, & work with minimum supervision.
• Must be a team player comfortable working with cross-functional teams across geographic boundaries with experience in leading teams and managing projects.

• Provides technical expertise by assessing the company products to recommend solutions that meet customer needs.
• Managing the product development and implementation process from design to production.
• Manage the preliminary and post sales technical requirements of new and existing customers on semiconductor package assembly projects.
• Present technical product and services offerings to potential and existing customers.
• Act as the first point of contact for technical inquiries, coordinate with the Sales and Operation teams to execute customer’s requests.
• Work as an integral part of the sales process, seek out new opportunities and provide technical feasibility feedback to the sales and executive management team.
• Initiate new package requirements through Design/Simulation process and follow through to close designs with customer.
• Manage all new devices from Design to Qualification to Production Ramp.
• Review and evaluate customer’s IC product packaging requirements. Provide package solutions within the packaging capability, package roadmap, process flow and design rules of the Company factories.
• Determine project technical specifications, coordinate Qualification builds and closure including production ramp of all Quals built. Identify and articulate requirements of Qualification lots from customer to factory.
• Address technical aspects of Customers QBRs (Quarterly Business Reviews).
• Coordinate quality related issues with the factory and closure with customers. Customer Crisis management for technical manufacturing problems. Interface between customer and factory for low yield analysis, CAR (Corrective Action Reports) and DOE (Design of Experiments).