Sr. Engineer, PDE Advanced Packaging BEOL

at  Micron

OUR VISION IS TO TRANSFORM HOW THE WORLD USES INFORMATION TO ENRICH LIFE FOR ALL.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR51024 Sr. Engineer, PDE Advanced Packaging BEOL

IDENTIFY, SELECT, AND EVALUATE NEW PROCESS, EQUIPMENT AND/OR TECHNOLOGY TO SUPPORT CURRENT AND FUTURE REQUIREMENTS FOR BEOL AREA

• Define, development and establish new process, equipment design and/or capability requirements aligned to Process and Packaging Roadmap
• Develop and engage creative solution for new process, equipment capabilities and/or solution to identified constraints or future technology requirements
• Work with equipment suppliers to develop new capability
• Actively participate in Package Development Engineering activities
• Conduct equipment benchmarking to establish the equipment suppliers and platforms for current and future need
• Create decision matrix for equipment and material selection

INSTALLATION AND QUALIFICATION OF NEW EQUIPMENT PLATFORM AND HANDOVER TO PRODUCTION GROUP (PILOT LINE SETUP)

• Plan/submit capital request to acquire new Equipment
• Create purchasing specification (Doc2) document
• Establish the new equipment qualification criteria and activities roadmap with respective functional team
• Establish project handover requirements and procedures upon machine qualification
• Prepare documentation for handing over with respective site owner
• Conduct data gathering for low volume production
• Conduct training for Site representatives/personnel
• Establish the feedback loop for Continuous Improvement after mass volume production

JOB REQUIREMENTS/ QUALIFICATIONS:

• PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
• Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
• Minimum 2 years’ experience in related semiconductor industry
• Experience with technical knowledge on assembly and/or wafer bumping packaging technology
• Advantage packaging technology and Front end of line background will be preferable and plus point
• Understanding and/or experience in equipment automation solution e.g. GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
• Fast learner, with initiative and independence (min supervision)
• Good team player, ability to integrate and cooperate with cross function teams and external vendors
• Strong communication and presentation skills
• Understanding of business needs and customers’ requirement
• Strong project management skills to ensure execution to timelines

Please refer the Job description for details