Thermal Engineer

at  Intel

JOB DESCRIPTION

We create world-changing technology that improves the life of every person on the planet. Intel put the silicon in Silicon Valley. Today we are applying our reach, scale, and resources to deliver on bold goals. And we’re not doing it alone: we work with our customers and galvanize the industry for positive impact.
Our team of accomplished researchers and architects shape the global PC ecosystem everyday - setting the standards, norms, and infrastructure for the entire PC industry. We start with research: how people use technology, how it can improve people’s lives, and what are the most compelling experiences. Next, we translate those experiences into a set of technical requirements and capabilities: IPs, SoCs, Software, Processors, Packaging and Platform. Finally, we have the privilege of leading teams from across Intel to bring these technologies to market with our advanced factories, our partners and customers from across the world selling hundreds of millions of units every year.
If you love to innovate, influence the direction of the PC industry, and help make the PC an indispensable tool for work, education, and creation - then this is the team for you. You will work alongside and learn from industry experts including Intel Fellows and Principal Engineers. The work is challenging. No two days will be the same. Architecting a solution to a real user problem and then seeing in their hands is an amazingly rewarding experience.
As part of the Client Computing Group (CCG), you will be defining and bringing to reality, solutions that delight customers and grow Intel’s business. Your day-to-day deliverables will have a common objective: making it easier, faster, and cheaper to innovate with Intel Architecture as compared with Intel’s competition.
In this position, you will be working in partnership with a software engineering team to develop specialized tools which will be used for die and package level thermal analysis and optimization of microprocessor design.
As a senior member of the team, you will also be expected to mentor more junior engineers in thermal analysis, design, and integration for a variety of products and form factors, such as notebook, desktop, and tablet computers.

QUALIFICATIONS

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

MINIMUM QUALIFICATIONS:

• Master’s degree in mechanical engineering or any STEM related degree with 6+ years of experience solving thermal and mechanical challenges in the electronics industry or bachelor’s degree in mechanical engineering or any STEM related degree with 9+ years of experience solving thermal and mechanical challenges in the electronics industry.
• 5+ years of experience with Computational Fluid Dynamics (CFD) simulations (e.g. IcePak, FloTHERM, ANSYS Fluent).

PREFERRED QUALIFICATIONS:

• Deep technical knowledge and experience with analyzing and designing thermal solutions for PCs.
• Experience with statistics and statistical software.
• Experience with any software scripting languages and thermal tool development.

• Driving end-to-end thermal design and development from initial concept to fruition ensuring thermal objectives are met.
• Designing thermal solutions to address platform energy efficiency and performance scaling.
• Defining product power and temperature limits based on system cooling capability and provides thermal parameters for product teams to use for HVM manufacturing.
• Conducting thermal analysis, designs, prototypes, and testing for air and liquid cooling solutions at various stages of product life cycle.
• Applying deep expertise in conduction, convection (passive and active), radiation, heat sinks, heat pipes, and vapor chambers to perform thermal and pressure drop characterization of cooling solution as a function of flow rates and validates model correlation.
• Driving thermal management system, tunes thermal solutions considering thermal interface materials and contact pressure as well as firmware-based thermal management policies to achieve maximum performance.
• Conducting thermal simulation and analysis that extends to within the silicon, electronic packaging, and PCB, with understanding of the thermal impact of material selection, stack-up, design layout, thermal dissipation power-map, and transient behavior.
• Delivering thermal design reviews and solutions to resolve problems.
• Collaborating cross-functionally with design, power, reliability, electrical, and mechanical teams to understand the platform requirements and constraints.
• Driving continuous technical readiness by conducting research, experiments, prototypes, and testing relevant to thermal engineering discipline.